Simulation of Copper Thin Film Thickness Optimization for Surface Plasmon using the Finite Element Method

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Leelawattananon, Tanaporn, Lorchalearnrat, Kritsakorn and Chittayasothorn, Suphamit (2017) Simulation of Copper Thin Film Thickness Optimization for Surface Plasmon using the Finite Element Method In: 7th International Conference on Simulation and Modeling Methodologies, Technologies and Applications, 2017-07-26, Madrid, Spain.

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Item Type:

Conference or Workshop Item (Paper)

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Deposited by:

ระบบ อัตโนมัติ

Date Deposited:

2021-09-09 23:53:50

Last Modified:

2022-02-23 18:13:08

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